![An electron beam device of some sort. [4032x3024 - 3.68MB]](https://pic8.co/sh/dEKAiG.jpg){kind=link}
Used in making masks and in intermediate wafer fabrication processes. The guy might have been making his own devices!
Interesting. So not detection, but etching.
Or sputter deposition.
Etch is usually chemical removal of metallic oxides created by the ebeam or light exposure. The ebeam or light precedes the etching of oxides from the wafer.
A uniform layer is deposited (sputter deposition) on the wafer (this process uses ion or atom beam bombardment). Then the wafer is exposed (through a reticule) to ebeam (or light) creating oxides on the areas of the wafer exposed to the light, then removal of those oxides with the chemical etch (like HF), wash (deionized ultra pure water), next layer .... repeat deposit, etch, wash ... repeat 20-40 times to stack layer upon layer depending upon which flavor of semiconductor you are fabricating.
That's an oversimplified explanation but good enough.
It's apparent there were things happening that are beyond my skills. It's like picking through the ruins of a lost culture trying to understand how they got a 50 ton stone 100 feet in the air.
(post is archived)