Making chips isn't "hard", machines do everything. I think what they mean is that the manufacturing process always creates flaws in the substrate. Depending on the physical size of the die determines how many flaws you will find on the die. Larger dies will obviously have more flaws on them. Therefore, the yield will be lower. Smaller dies will have fewer flaws, so your yield will be higher. As the circuits shrink, the number of flaws increase.
Making chips isn't "hard", machines do everything. I think what they mean is that the manufacturing process always creates flaws in the substrate.
Why don't you just watch the video? It's quite good. The "hard" part is that the machines are incredibly expensive, cutting edge, a consolidated into a handful of companies.
Not entirely true as I worked on designing machines that did large 9" wafers years ago that were used to make memory chips and they used larger features than GPUs and CPUs of the time and had less flaws per die than those wafers.
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